A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin
نویسندگان
چکیده
منابع مشابه
An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant
Silicone resin has recently attracted great attention as a high-power Light Emitting Diode (LED) encapsulant material due to its good thermal stability and optical properties. In general, the abrupt curing reaction of the silicone resin for the LED encapsulant during the curing process induces reduction in the mechanical and optical properties of the LED product due to the generation of residua...
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Yanyan Tang†, Clifford L. Henderson†, John Muzzy†, David W. Rosen* † School of Chemical & Biomolecular Engineering, 311 Ferst Drive, N.W., Georgia Institute of Technology, Atlanta, GA 30332-0100 *Corresponding author; School of Mechanical Engineering, 813 Ferst Drive, N.W., Georgia Institute of Technology, Atlanta, GA 30332-0405; Email: [email protected] Reviewed, accepted September 1, ...
متن کاملHardening of dual-cure resin cements and a resin composite restorative cured with QTH and LED curing units.
OBJECTIVE The aim of this study was to determine the effects of light intensity and type of light unit (quartztungsten-halogen [QTH] or light-emitting diode [LED]) on the hardening of various resin cements and a resin composite restorative. METHODS Disk specimens were prepared from 4 dual-cured resin cements (Variolink II, Calibra, Nexus 2 and RelyX ARC). Two QTH light-curing units (Visilux 2...
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OBJECTIVE This study evaluated the surface hardness of a resin cement (RelyX ARC) photoactivated through indirect composite resin (Cristobal) disks of different thicknesses using either a light-emitting diode (LED) or quartz tungsten halogen (QTH) light source. MATERIAL AND METHODS Eighteen resin cement specimens were prepared and divided into 6 groups according to the type of curing unit and...
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This paper introduces a new method for accelerating current sluggish FEM and improving memory demand in FEM problems with high node resolution or bulky structures. Like most of the numerical methods, FEM results to a matrix equation which normally has huge dimension. Breaking the main matrix equation into several smaller size matrices, the solving procedure can be accelerated. For implementing ...
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ژورنال
عنوان ژورنال: Transactions of Materials Processing
سال: 2012
ISSN: 1225-696X
DOI: 10.5228/kstp.2012.21.2.101